fixed HQFP ground pads

master
Mario Hüttel 2016-12-13 20:26:31 +01:00
parent c0ee16d86a
commit 0d0e38c1b7
2 changed files with 72 additions and 72 deletions

View File

@ -1,11 +1,11 @@
(module HQFP-100_14x14mm_Pitch0.5mm_handsoldering (layer F.Cu) (tedit 584D7D4D)
(module HQFP-100_14x14mm_Pitch0.5mm_handsoldering (layer F.Cu) (tedit 584FF58E)
(descr "100-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -9.45) (layer F.SilkS)
(fp_text reference U401 (at 0 -9.45) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TQFP-100_14x14mm_Pitch0.5mm (at 0 9.45) (layer F.Fab)
(fp_text value TFP401 (at 0 9.45) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -7.175 -6.45) (end -8.45 -6.45) (layer F.SilkS) (width 0.15))
@ -129,7 +129,7 @@
(pad 3 smd rect (at -7.7 -5) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -7.7 -5.5) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -7.7 -6) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 101 thru_hole rect (at 0 0) (size 5.2 5.2) (drill 3) (layers *.Cu *.Mask))
(pad 101 thru_hole rect (at 0 0) (size 5.3 5.3) (drill 3) (layers *.Cu *.Mask))
(model Housings_QFP.3dshapes/TQFP-100_14x14mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))

View File

@ -1,11 +1,11 @@
(module HQFP-64_10x10mm_Pitch0.5mm_handsoldering (layer F.Cu) (tedit 584D7D8D)
(module HQFP-64_10x10mm_Pitch0.5mm_handsoldering (layer F.Cu) (tedit 584FF437)
(descr "64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFP 0.5")
(attr smd)
(fp_text reference REF** (at 0 -7.45) (layer F.SilkS)
(fp_text reference U501 (at 0 -7.45) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TQFP-64_10x10mm_Pitch0.5mm (at 0 7.45) (layer F.Fab)
(fp_text value TFP410 (at 0 7.45) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -5.175 -4.225) (end -6.45 -4.225) (layer F.SilkS) (width 0.15))
@ -29,71 +29,71 @@
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 64 smd rect (at -3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 63 smd rect (at -3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 62 smd rect (at -2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 61 smd rect (at -2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 60 smd rect (at -1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 59 smd rect (at -1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 58 smd rect (at -0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 57 smd rect (at -0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 56 smd rect (at 0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 55 smd rect (at 0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 54 smd rect (at 1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 53 smd rect (at 1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 52 smd rect (at 2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 51 smd rect (at 2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 50 smd rect (at 3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 49 smd rect (at 3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 48 smd rect (at 5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 47 smd rect (at 5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 46 smd rect (at 5.7 -2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 45 smd rect (at 5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 44 smd rect (at 5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 43 smd rect (at 5.7 -1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 42 smd rect (at 5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 41 smd rect (at 5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 40 smd rect (at 5.7 0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 39 smd rect (at 5.7 0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 38 smd rect (at 5.7 1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 37 smd rect (at 5.7 1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 36 smd rect (at 5.7 2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 35 smd rect (at 5.7 2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 34 smd rect (at 5.7 3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 33 smd rect (at 5.7 3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 32 smd rect (at 3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 31 smd rect (at 3.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 30 smd rect (at 2.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 29 smd rect (at 2.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at 1.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at 1.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at 0.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at 0.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at -0.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at -0.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at -1.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at -1.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at -2.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at -2.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at -3.25 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at -3.75 5.7 90) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at -5.7 3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at -5.7 3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at -5.7 2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at -5.7 2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at -5.7 1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at -5.7 1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -5.7 0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -5.7 0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -5.7 -0.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -5.7 -0.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -5.7 -1.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -5.7 -1.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -5.7 -2.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -5.7 -2.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -5.7 -3.25) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -5.7 -3.75) (size 1.5 0.3) (layers F.Cu F.Paste F.Mask))
(pad 65 thru_hole rect (at 0 0) (size 4.3 4.3) (drill 3) (layers *.Cu *.Mask))
(pad 64 smd rect (at -3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 63 smd rect (at -3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 62 smd rect (at -2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 61 smd rect (at -2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 60 smd rect (at -1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 59 smd rect (at -1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 58 smd rect (at -0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 57 smd rect (at -0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 56 smd rect (at 0.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 55 smd rect (at 0.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 54 smd rect (at 1.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 53 smd rect (at 1.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 52 smd rect (at 2.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 51 smd rect (at 2.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 50 smd rect (at 3.25 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 49 smd rect (at 3.75 -5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 48 smd rect (at 5.7 -3.75) (size 1.5 0.3) (layers F.Cu))
(pad 47 smd rect (at 5.7 -3.25) (size 1.5 0.3) (layers F.Cu))
(pad 46 smd rect (at 5.7 -2.75) (size 1.5 0.3) (layers F.Cu))
(pad 45 smd rect (at 5.7 -2.25) (size 1.5 0.3) (layers F.Cu))
(pad 44 smd rect (at 5.7 -1.75) (size 1.5 0.3) (layers F.Cu))
(pad 43 smd rect (at 5.7 -1.25) (size 1.5 0.3) (layers F.Cu))
(pad 42 smd rect (at 5.7 -0.75) (size 1.5 0.3) (layers F.Cu))
(pad 41 smd rect (at 5.7 -0.25) (size 1.5 0.3) (layers F.Cu))
(pad 40 smd rect (at 5.7 0.25) (size 1.5 0.3) (layers F.Cu))
(pad 39 smd rect (at 5.7 0.75) (size 1.5 0.3) (layers F.Cu))
(pad 38 smd rect (at 5.7 1.25) (size 1.5 0.3) (layers F.Cu))
(pad 37 smd rect (at 5.7 1.75) (size 1.5 0.3) (layers F.Cu))
(pad 36 smd rect (at 5.7 2.25) (size 1.5 0.3) (layers F.Cu))
(pad 35 smd rect (at 5.7 2.75) (size 1.5 0.3) (layers F.Cu))
(pad 34 smd rect (at 5.7 3.25) (size 1.5 0.3) (layers F.Cu))
(pad 33 smd rect (at 5.7 3.75) (size 1.5 0.3) (layers F.Cu))
(pad 32 smd rect (at 3.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 31 smd rect (at 3.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 30 smd rect (at 2.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 29 smd rect (at 2.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 28 smd rect (at 1.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 27 smd rect (at 1.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 26 smd rect (at 0.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 25 smd rect (at 0.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 24 smd rect (at -0.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 23 smd rect (at -0.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 22 smd rect (at -1.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 21 smd rect (at -1.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 20 smd rect (at -2.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 19 smd rect (at -2.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 18 smd rect (at -3.25 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 17 smd rect (at -3.75 5.7 90) (size 1.5 0.3) (layers F.Cu))
(pad 16 smd rect (at -5.7 3.75) (size 1.5 0.3) (layers F.Cu))
(pad 15 smd rect (at -5.7 3.25) (size 1.5 0.3) (layers F.Cu))
(pad 14 smd rect (at -5.7 2.75) (size 1.5 0.3) (layers F.Cu))
(pad 13 smd rect (at -5.7 2.25) (size 1.5 0.3) (layers F.Cu))
(pad 12 smd rect (at -5.7 1.75) (size 1.5 0.3) (layers F.Cu))
(pad 11 smd rect (at -5.7 1.25) (size 1.5 0.3) (layers F.Cu))
(pad 10 smd rect (at -5.7 0.75) (size 1.5 0.3) (layers F.Cu))
(pad 9 smd rect (at -5.7 0.25) (size 1.5 0.3) (layers F.Cu))
(pad 8 smd rect (at -5.7 -0.25) (size 1.5 0.3) (layers F.Cu))
(pad 7 smd rect (at -5.7 -0.75) (size 1.5 0.3) (layers F.Cu))
(pad 6 smd rect (at -5.7 -1.25) (size 1.5 0.3) (layers F.Cu))
(pad 5 smd rect (at -5.7 -1.75) (size 1.5 0.3) (layers F.Cu))
(pad 4 smd rect (at -5.7 -2.25) (size 1.5 0.3) (layers F.Cu))
(pad 3 smd rect (at -5.7 -2.75) (size 1.5 0.3) (layers F.Cu))
(pad 2 smd rect (at -5.7 -3.25) (size 1.5 0.3) (layers F.Cu))
(pad 1 smd rect (at -5.7 -3.75) (size 1.5 0.3) (layers F.Cu))
(pad 65 thru_hole rect (at 0 0) (size 5.3 5.3) (drill 3) (layers *.Cu *.Mask))
(model Housings_QFP.3dshapes/TQFP-64_10x10mm_Pitch0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))