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mirror of https://git.shimatta.de/pcb/headphone-amp.git synced 2024-11-25 03:25:06 +01:00

add 3d model for USB jack

This commit is contained in:
Mario Hüttel 2017-11-13 22:13:47 +01:00
parent cd6e51109f
commit 85722e0b51

View File

@ -497,6 +497,11 @@
(net 30 /D-)) (net 30 /D-))
(pad 1 smd rect (at 3.44932 -1.6002) (size 2.30124 0.50038) (layers F.Cu F.Paste F.Mask) (pad 1 smd rect (at 3.44932 -1.6002) (size 2.30124 0.50038) (layers F.Cu F.Paste F.Mask)
(net 3 +5V)) (net 3 +5V))
(model ${KISYS3DMOD}/smd.shapes3d/USB_JACK.x3d
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
) )
(module Capacitors_THT:C_Radial_D5_L11_P2 (layer F.Cu) (tedit 0) (tstamp 5978A773) (module Capacitors_THT:C_Radial_D5_L11_P2 (layer F.Cu) (tedit 0) (tstamp 5978A773)